IMS2012 International Microwave Symposium

The highlight of the Plenary Session is the keynote presentation to be given by Steve Mollenkopf, president and chief operating officer of Qualcomm. From his leadership role in Qualcomm, one of the greatest and most successful global telecommunication corporations, as well as pioneer of code division multiple access (CDMA) technology, Mr. Mollenkopf is ideally positioned to provide authoritative perspective on microwave technology and business which should be of interest to all IMS attendees. His talk will be titled “3G/4G Chipsets and the Mobile Data Explosion.” Note that this talk will be streamed live on IEEE.tv

Abstract of the talk

The rapid growth of wireless data and complexity of 3G and 4G chipsets drives new design and deployment challenges for radio and device manufacturers along with carriers. This talk will provide a perspective on the problem from the point of view of a large, worldwide manufacturer of semiconductors and technology for cellular and connected consumer electronics devices. The increase in device and network complexity will result in significant business opportunities for the industry.

Biography of the Speaker

Steve Mollenkopf leads Qualcomm’s business operations, product, and worldwide sales groups. In this role, Mr. Mollenkopf also serves as president of Qualcomm CDMA Technologies (QCT). Moreover, he is a member of Qualcomm’s Executive Committee, helping to drive Qualcomm’s overall global strategy.

Since 2008, Mr. Mollenkopf led QCT and served as executive vice president and group president of Qualcomm, driving growth and providing critical technical and operational leadership. QCT, the company’s semiconductor business, is the world’s largest wireless chip supplier and fabless semiconductor company in terms of revenue.

A published IEEE author, Mr. Mollenkopf holds patents in areas such as power estimation and measurement, multistandard transmitter system, and wireless communication transceiver technology. He serves on the Board of Directors for the Semiconductor Industry Association and also serves as a board member of the Board Executive Committee and CEO Council for the Global Semiconductor Alliance.

Mr. Mollenkopf holds two electrical engineering degrees, a B.S. in electrical engineering from Virginia Tech and an M.S. in electrical engineering from the University of Michigan at Ann Arbor.

Text from the IMS special issue of the IEEE Microwave Magazine, May 2012.

English

Sponsors